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  • Wafer & semikonduktor polishing slurry mangrupakeun slurry silika koloid dikembangkeun hususna keur polishing keramik, jeung substrat éléktronik kayaning litium tantalate (LiTaO3), litium niobate (LiNbO3), sarta 'Glass Photomask, Ferrite Keramik, Ni-P Disk, Kristal, PZT Keramik. , Keramik Barium Titanate, Silikon Bulistir, Keramik Alumina, CaF2, Rework Wafer Silicon Bare, Keramik SiC, Safir, Substrat Elektronik, Keramik, Kristal. Kalawan uniformity partikel alus teuing jeung dispersal, éta delivers laju panyabutan tinggi na polishing bébas karuksakan.

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  • Ieu slurry polishing nu ngahasilkeun eunteung finish dina sagala jinis logam kayaning aluminium, stainless steel, sarta titanium.

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  • Ieu bubuk polishing Cerium oksida, kakuatan polishing pikeun kaca dipaké pikeun-speed tinggi polishing, kayaning: kaca telepon sélulér, lénsa-precision tinggi, lénsa optik, layar LCD, jsb.

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  • The polisher sisi tunggal loba dipaké pikeun grinding single-sided na polishing of alumina keramik, Zirconia (PSZ) Keramikï¼SiC Keramik, Kaca optik Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, ring segel, Stainless Steel, Titanium Alloy, Cemented. Carbide, Tungsten Steel jsb.

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  • Aplikasi Alat Pangolahan Wafer: Wafer semikonduktor ngagiling atanapi ngipis deui bahan canggih, sapertos: SiC, GaAs, Sapphire, Si, GaN, InP.

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  • Aplikasi The Ultra-Thin Grinding: Ultra-Thin Grinding atanapi back-thinning tina bahan canggih, sapertos: SiC, GaAs, Sapphire, Si, GaN, InP.

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